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UMC's ASICplus Program Chosen by Zucotto Wireless Inc. for Development of Its Xpresso Family of Java Technology-Based Processors
SUNNYVALE, Calif.--(BUSINESS WIRE)--June 4, 2001--
UMC (NYSE:UMC), a world leading semiconductor foundry, today
announced that its ASICplus program has been chosen by Zucotto
Wireless Inc. to assist in the development of its Xpresso(TM) family
of Java(TM) technology-based processors. The Xpresso 100, a
high-speed, small-footprint, microcontroller, is currently being
tested and will be followed shortly with the Xpresso 120 application
processor. Under the provisions of the program, UMC, with one of its
ASICplus partners, RealChip Communications Inc., is providing Zucotto
with services that include cutting-edge process technologies; foundry
manufacturing capacity; a vast portfolio of silicon-proven
intellectual property (IP); design expertise; and complete back-end
support, packaging, and testing.
Through the ASICplus program, UMC and its fabless ASIC partners
offer comprehensive, front-to-back ASIC development capabilities
including design initiation, manufacturing and testing, and packaging
solutions. ``RealChip has the expertise in creating leading-edge SoC
solutions for the communications market, along with tremendous prowess
in testing and packaging,'' said Ed Wan, vice president of worldwide
field engineering for UMC. ``We believe that the ASICplus program
chosen by Zucotto will produce the world-class Java technology-based
processors they expect.''
Dr. Thomas Liao, senior vice president, operations, at RealChip
Communications Inc., noted, ``Our partnership with UMC has allowed us
to deliver a complete design through production services solution,
including leading-edge manufacturing services and capacity provided by
UMC, while we concentrate on our areas of expertise -- complex
communications design, testing, and packaging. Our most recent work
with Zucotto further demonstrates the success of the ASICplus
program.''
``As competition in the communications industry is ever increasing,
early tape-out is more important than ever before,'' stated Dave Carey,
chief operating officer at Zucotto. ``By working with UMC and its
ASICplus partner, RealChip Communications, Zucotto is not only
provided with great service and expertise, but is also able to bring
its leading-edge solution to market much earlier than expected -- from
netlist to tape-out in less than two months.''
About UMC's ASICplus Program
UMC's ASICplus program offers systems companies a complete ASIC
development solution, through partnerships with premier fabless ASIC
design companies, which includes design handoff at either the
specification, RTL, or netlist level, and the ability to embed
customer-specific IP, along with IP kitted from the ASICplus partner.
In the ASICplus program, UMC continues to focus on its core
competencies, technology development, and manufacturing efficiency,
while the partners offer the full front-end and back-end services that
many customers require to bring their designs into production. The
program provides customers with the flexibility to choose support for
any part of their chip development process, from design specification
through to determining which IP and libraries to utilize, and managing
final testing and packaging.
About UMC
UMC, a world leading semiconductor foundry, operates seven wafer
fabs in Taiwan's Hsinchu Science Park. UMC's Japanese subsidiary,
Nippon Foundry Inc., has one fab in Japan, and UMC's joint venture
with Hitachi, Trecenti Technologies, began pilot production in its
300mm fab in Japan in 2000. UMC is scheduled for pilot production in
June 2001 with a 300mm facility in Taiwan's Tainan Science Park and
has announced plans for a third 300mm fab to be built in Singapore.
UMC is a leader in foundry technology, with facilities that reached an
annual output of more than 2.4 million eight-inch equivalent wafers in
2000 and shipped more silicon wafers in 0.18 micron and smaller
technologies than any other foundry that year. UMC's joint development
program with IBM and Infineon Technologies introduced the
WorldLogic® standard 0.13 micron technology in 2000. UMC serves
customers around the world through sales and marketing offices located
in the United States, Japan, and the Netherlands. UMC can be found on
the web at http://www.umc.com.
About Zucotto Wireless
Zucotto Wireless Inc. is the world leader in merging wireless
connectivity with Java technology to create unique semiconductor-based
solutions. Zucotto's flagship line of Xpresso Java technology-based
processors is the only family of products on the market designed
specifically to meet the performance demands of memory-constrained,
battery-powered mobile Internet devices capable of hosting multimedia
applications. In addition, Zucotto offers a range of value-added
extensions for the Xpresso processor, including Bluetooth(TM) baseband
IP and Java technology-based upper stack software. Zucotto's
productivity-enhancing tools, the WHITEboard(TM) SDK and
XPRESSOboard(TM) HDK, enable developers to speed wireless Java
applications to market. The company has offices in San Diego, USA;
Ottawa, Canada; and Copenhagen, Denmark. For more information, please
visit www.zucotto.com.
ASICplus is a trademark and WorldLogic is a registered trademark
of UMC. All other trademarks and registered trademarks are the
property of their respective companies.
Zucotto Wireless, Zucotto (stylized-handwritten logo), Xpresso,
XPRESSOcore, XPRESSOboard, SLICE, and WHITEboard are trademarks or
registered trademarks of Zucotto Wireless Inc. in the United States
and/or other countries.
Sun, Sun Microsystems, the Sun Logo, Java Community Process, J2ME,
Java, and Jini are trademarks or registered trademarks of Sun
Microsystems, Inc. in the United States and other countries. Bluetooth
is a trademark owned by the Bluetooth SIG, Inc. and used by Zucotto
Wireless Inc. under license. All other registered trademarks mentioned
are property of their respective owners.
The Zucotto Wireless products or technologies described herein are
protected by one or more patents or patents pending in the United
States or other countries.
Contact:
UMC - USA
Eileen Elam, 650/917-1488
KjcomE@cs.com
or
UMC - Taiwan
Alex Hinnawi, (886) 2-2700-69999 ext. 6958
Alex hinnawi@umc.com.tw
or
Zucotto Wireless, Inc.
Ellie Sanchez, 858/777-1300
esanchez@zucotto.com
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